Soic package pdf
Ceramic package . The Exposed Pad EP variant of small outline packages can increase heat dissipation by as much as 1. Plastic DIP . Glass-sealed ceramic DIP . March 22, Main article: Quad Flat Package.
SOIC-8 (FS PKG Code S1). 1: 1. Scale on letter size paper. Dimensions shown below are in: inches [millimeters].
Part Weight per unit (gram): various Freescale SOIC packages assembled internally or at The SOIC is a surface mount integrated circuit package.
be downloaded as a PDF file. R0 (March ).
Package Details. SOIC-8 Case. Mechanical Drawing.
Mounting Pad Geometry (Dimensions in mm). Lead Code.
Also used for LEDs. A thin small-outline package TSOP is a rectangular, thin bodied component.
Non-standard DIP with smaller 0. March 22, Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier.
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|No lead . Micro surface-mount device extended technology . Archived from the original on Namespaces Article Talk. Super ball-grid array . Package is same size as silicon .|
Mounting Pad Geometry ( Dimensions in mm).
Lead Code: Reference individual device datasheet. A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit ( IC) package. Create a book · Download as PDF · Printable version. Integrated circuits are put into protective packages to allow easy handling and assembly onto.
mini-SOIC, Mini small-outline integrated circuit. MSOP, Mini. Archived from the original (PDF) on Retrieved CS1 maint.
Land grid array . Also called as micro lead frame MLF. Archived from the original PDF on In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit.
Plastic quad flat-package  . Also used for LEDs. This article needs additional citations for verification.
Video: Soic package pdf How to identify SOIC or SO package pin configuration.
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|No lead . Archived from the original on Plastic DIP . Retrieved Through-hole technology uses holes drilled through the PCB for mounting the components. The McGraw-Hill Companies. Namespaces Article Talk.|
SOIC Package Dimensions. JuneRev. A2. Scale on letter size paper. Dimensions shown below are in. SOIC (FS PKG Code S3). SOIC Package Dimensions. OctoberRev. A1. Scale on letter size paper. Dimensions shown below are in. (W) SOIC Package. Pin Surface Mount, Wide Body. NOTE: ALL MEASUREMENTS ARE IN MILLIMETERS. MIN.
Ceramic pin-grid array . QFP with metric pin distribution . Plastic quad flat-package  . Archived from the original on Please help improve this article by adding citations to reliable sources.
Non-standard DIP with smaller 0. Categories : Chip carriers Semiconductor packages Electronics lists.
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Flip-chip pin-grid array . Archived from the original PDF on Main article: Quad Flat Package. Archived from the original PDF on January 8, Categories : Chip carriers Semiconductor packages Electronics lists. Note that because of this, SOIC is not specific enough of a term to describe parts which are interchangeable.